BOND Solder Wire 63/37 250g

The BOND 63/37 solder wire is a 250g spool of eutectic tin-lead alloy, formulated specifically for reliable electronics soldering. Unlike standard 60/40 solder, the 63/37 blend transitions instantly between liquid and solid states at exactly 183°C. This eliminates the semi-solid phase during cooling, significantly reducing the risk of cold or disturbed joints when soldering heavy motor wires or XT60 pigtails that might shift slightly before setting.

Key features

• Eutectic alloy: Instantly solidifies at 183°C to prevent dull, brittle solder joints on high-current drone pads.
• 0.8mm wire diameter: Offers fine control for delicate flight controller UARTs while melting rapidly enough to tin thick ESC pads.
• Rosin core: Integrated flux promotes rapid wetting and strong adhesion across copper pads and wire strands.
• 250g spool: A heavy-duty roll that provides enough material to cover dozens of full multirotor builds and bench repairs.

Specifications

• Alloy composition: 63% Tin (Sn) / 37% Lead (Pb)
• Wire diameter: 0.8mm
• Melting point: 183°C (Eutectic)
• Spool weight: 250g

For large 12AWG to 14AWG battery leads, pair this 0.8mm wire with a high-wattage iron (65W or greater) and a large chisel tip to ensure rapid heat transfer and proper capillary action into the wire strands.