SEQURE S60 Nano Electric Soldering Iron Kit
SEQURE S60 Nano Electric Soldering Iron Kit
SEQURE S60 Nano Electric Soldering Iron Kit
SEQURE S60 Nano Electric Soldering Iron Kit
SEQURE S60 Nano Electric Soldering Iron Kit
SEQURE S60 Nano Electric Soldering Iron Kit
SEQURE
Soldering

SEQURE S60 Nano Electric Soldering Iron Kit

₹3,869Incl. GST

SKU SEQURE-S60-NANO-IS

Tip: ISMade in India: NoBrand: SEQUREProduct Type: Soldering IronPower: 60 W

Free standard shipping on orders of ₹999 and above. Pan India delivery from Gurugram, Haryana.

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Product details

The Sequre S60 Nano is a compact, USB Type-C powered soldering iron engineered for precision drone builds, field repairs, and micro-soldering tasks. Delivering up to 60 W of output power through standard PD and QC fast-charging protocols, it reaches solder-melting temperatures in seconds, making it ideal for working on dense flight controller pads, receiver wiring, and delicate SMD components.

Key features

  • Delivers up to 60 W maximum heating power via USB Type-C using PD or QC power sources at 12 V.
  • Adjustable operating temperature from 50°C to 500°C with real-time feedback on an integrated OLED screen.
  • Includes an IS-type bent conical soldering tip, suited for precise reach between tightly stacked drone electronics.
  • Features configurable intelligent sleep mode, automatic shutdown protection, and firmware upgrade capability via USB.

Specifications

  • Power interface: USB Type-C
  • Supported protocols: PD, QC
  • Maximum power: 60 W (with a 12 V 5 A / 60 W supply; the included power head gives about 30 W)
  • Maximum input voltage: 12 V
  • Temperature range: 50°C – 500°C
  • Display: 0.91-inch OLED
  • Tip compatibility: C210 series
  • Included tip profile: IS (bent conical)
  • Size: 120 x 10 x 12 mm
  • Weight: 22 g
  • In the box: Iron, IS tip, power head, USB cable, iron stand, manual, storage bag

Whether making track-level repairs on an AIO board or attaching signal wires at the field using a USB-C power bank, the S60 Nano provides accurate thermal regulation and rapid heat recovery in an ultra-lightweight form factor.

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